This high-temperature tape utilizes a non-silicone adhesive formulation which eliminates concerns about silicone contamination on the masked areas.
It also has designed static dissipative performance attributes and produces very low static charge during unwinding and removal making it desirable in static-sensitive applications.
3M tape 7419 has been designed to remove cleanly from a variety of typical electronic substrates including FR-4, polyimide, gold, copper, and silicon after high-temperature processing.
3M 7419 Features
Specially formulated acrylic adhesive is resistant to typical solder mask temperatures for short periods of time, stays firmly in place during processing, and removes cleanly from typical electronic substrates even after 10 min @ 260°C (500°F).
Non-silicone adhesive formulation lessens the potential for silicone contamination which can interfere with subsequent bonding or conformal coating operations.
The high-temperature acrylic adhesive also has excellent chemical resistance and can be considered for demanding chemical masking applications.
The product is wound on a polyethylene tape core.
3M 7419 Applications
Masking or protecting residue sensitive areas on printed circuit boards during high temperature operations such as wave soldering and solder reflow
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