3M 1181 is a 2.6-mil (0.066 mm) thick tape composed of a 1.4-mil (0.036 mm) flat copper foil backing coated on one side with a non-corrosive, electrically conductive acrylic pressure-sensitive adhesive supplied on a removable liner.
Color: Copper
Thickness: 2.6-mil (0.066 mm)
Backing: Copper Foil - Flat
Adhesive: Electrically Conductive Acrylic
Dead soft 1-ounce (1.4-mil) copper foil backing for good shielding effectiveness, soldering, and converting (slitting and die cutting)
UL recognized flame-retardancy per UL 510 for applications needing this property
Conductive particles in the adhesive provide low contact resistance between the substrate and the backing to drain static charge
The acrylic pressure-sensitive adhesive has good resistance to heat, oxidation, solvents, and oils
The removable liner makes it easy to handle and die-cut complex shapes
There are both standard and custom roll widths and lengths to meet a variety of application needs
3M 1181 Features
Can be die-cut, is solderable, and offers a multitude of uses in electrical design and testing.
laboratories for prototyping, design, and troubleshooting.
The adhesive requires no moisture, solvents, heat, or other manner of preparation to affect the application.
Flame Retardant per UL-510A Standard.
The unplated copper with conductive adhesive is a common EMI shielding tape for non-corrosive conditions.
Highly conductive particles in the acrylic adhesive provide a multitude of electrical paths between the application substrate and the surface of the copper foil.
The acrylic adhesive has good resistance to heat, oxidation, solvents, and oils.
3M 1181 Applications
Commonly used for EMI/RFI shielding applications in the electronics industry and for static charge draining, seaming shielded rooms, cable wrapping, and surface contact to non-solderable materials.
This tape is designed for a variety of applications: point-to-point electrical contact, EMI/RFI shielding, grounding, and static charge draining.
These tapes can be used in both electronic & electrical devices, shielded rooms, and EMI test laboratories for prototyping, design, and troubleshooting.
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