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3M DP270

3M DP270 Epoxy Potting Compound/Adhesive DP270 (or 3M™ Scotch- Weld™ Epoxy Potting Compound/Adhesive 270 B/A) is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components and is available in clear or black.

  • Adhesive Type: Epoxy
  • Application: Hard Disk Drive Component Assembly, Potting
  • Assembly Type: Potting & Encapsulating

DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, has minimal exotherm, and has very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
Scotch-Weld epoxy potting compound/adhesive DP270 is non-corrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions.

3M DP270
3M DP270
3M DP270
3M DP270

3M DP270 Features

  • Good Thermal Shock Resistance
  • Excellent Electrical Properties
  • Meets UL 94 HB (File No. E61941)
  • Noncorrosive to Copper
  • Long Worklife
  • Negligible Exotherm

3M DP270 Applications

  • Potting and bonding electrical components

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