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3M DP100

3M DP100 is a two-part adhesive offering fast cure and machinability.

  • Adhesive Type: Epoxy
  • Application: Bonding, Hard Disk Drive Component Assembly, Bonding Composite Materials, Large Surface Lamination Assembly, Potting, Sealing, Potting and Encapsulating, Small Joint Assembly, Panel Frame/Stiffner to Panel Assembly
  • Assembly Type: Mounting & Trim Attachment, Small Joint Assembly
  • Product Color: Transparent

3M DP100 Clear is a two-part, rigid epoxy adhesive offering a fast cure and machinability. The low-viscosity, clear formulation works on a variety of substrates including metal, glass, ceramic, stone, and various plastics.
This adhesive cures rigid for high static load holding and high shear strength to ensure lasting bonds, making it ideal for multiple applications in the transportation, general industrial, signage, appliance, and construction industries.
The mix ratio is 1:1 for quick, precise dispensing and a fast 5-minute work-life.
The adhesive reaches handling strength in approximately 20 minutes and is fully cured in 48 hours at 72 °F (22 °C).
When using this, or other Duo-Pak (DP) size adhesives, rely on 3M Applicators for convenient and accurate metering, mixing, and dispensing.

3M DP100
3M DP100
3M DP100
3M DP100

3M DP100 Features

  • BONDS A VARIETY OF SUBSTRATES: Bonds metal, glass, stone, and various plastics
  • MULTIPLE APPLICATIONS AND MARKETS: Can be used in joining, gluing, and structural bonding in transportation, general industrial, and signage segments, as well as a variety of other applications
  • TWO-PART, RIGID EPOXY: This adhesive formula cures rigid for high static load holding and high shear strength to ensure lasting bonds
  • QUICK SET TIME: Features a 5-minute working time, reaching handling strength in 20 minutes at room temperature
  • TRANSPARENT BOND LINES: A low viscosity, clear formulation works on a variety of substrates
  • CERTIFICATIONS: DP100 is UL 94 HB Certified

3M DP100 Applications

  • General attachment applications in a variety of industries
  • Attachment of various substrates that require permanency
  • Applications that require machining afterward
  • Applications requiring transparent bond lines

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