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3M 9703

3M 9703 is a low-outgassing Z-axis anisotropic electrically conductive pressure-sensitive adhesive (CPSA) tape.
It’s a double-sided tape filled with silver conductive particles for the interconnection of electronic substrates.
Featuring very high electrical conductivity, it provides low resistance for small contact areas and high frequencies.
Used in EMI shielding and grounding applications, this conductive tape can help enable Z-axis interconnects without shorting adjacent circuitry.
It can also help devices manage electromagnetic compatibility needs and provide robust protection against EMI in a range of market segments with low outgassing requirements

  • Adhesive Type: Acrylic
  • Application: EMI Grounding
  • Product Usage: FPC, Main Logic Boards, Sensors
  • Total Tape Thickness without Liner (Imperial):2 mil
  • 3M ECATT 9703 electrically connects and mechanically bonds medium-pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB), or LCD screens.
  • 3M ECATT 9703 is electrically conductive and offers good adhesion to common PCB substrates such as copper, gold, FR-4 epoxy, DuPont™ Kapton™ polyimide, and polyester films.
  • Stable electrical performance in any flexible circuit interconnection application may require mechanical reinforcement (clamping).
  • 3M ECATT 9703 also electrically connects and mechanically bonds EMI/RFI shields and gaskets to metal frames and enclosures. The low contact resistance and tape construction result in good EMI performance.
  • 3M ECATT 9703 can be applied as die-cut parts or in roll form and has good adhesion to common EMI/RFIsubstrates such as aluminum, stainless steel, and smooth gasket materials.
3M 9703
3M 9703
3M 9703
3M 9703

3M 9703 Features

  • Low-outgassing acrylic adhesive
  • Anisotropic Z-axis electrical conductivity
  • Pressure-sensitive adhesive (PSA) tack properties
  • Thermal curing is not required
  • Easy to use in assembly operations
  • Can be applied as die-cut parts or in roll form

3M 9703 Applications

  • Electrical connectivity to medium-pitch flexible circuits and PCBs
  • Flex circuit to flex circuit interconnection
  • PCB/flex/chassis grounding
  • EMI shield & gasket attachment
  • Electrostatic discharge (ESD)

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