3M 5419

3M 5419 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high-temperature applications. Low Static.

  • Color: Gold
  • Thickness: 2.7 mils (0.07 mm)
  • Backing: Polyimide
  • Adhesive: Silicone
  • Temperature Use Range: -73° to 260°C (-100° to 500°F)

3M™ Low Static Polyimide Film Tape 5419 is a translucent, polyimide film-backed silicone adhesive tape with unique
and extremely low electrostatic discharge properties.

Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal from the PWB.
Conventional polyimide tapes can typically generate over 10,000 volts during use which can damage board-mounted electronic components.
3M tape 5419 overcomes this problem without any of the typical drawbacks of conventional "anti-static" or "static-free" tapes (e.g., variable adhesion and opaqueness). Halogen-Free Definition: "Halogen Free" refers to the International Electrochemical Commission’s Definition, IEC 61249-2-21, which sets the limits of 900 ppm maximum chlorine; 900 ppm maximum bromine; 1500 ppm maximum total halogens
DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures

  • No rework is required, enabling high productivity
  • Protects surfaces helping reduce replacement parts
  • Available on cardboard or polyethylene core
3M 5419
3M 5419
3M 5419
3M 5419

3M 5419 Features

  • At room temperature the properties of polyimide and polyester film are similar. However, as the temperature increases or decreases, the properties
  • of the polyimide film are less affected than polyester.
  • Polyimide film does not soften at elevated temperatures, thus, the film provides an excellent release surface at elevated temperatures
  • Gold tab protection during wave solder of printed circuit boards.
  • RoHS compliant.

3M 5419 Applications

  • Mask for printed circuit boards during wave solder or solder dip process
  • Used as release surface in the fabrication of parts cured at elevated temperatures

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